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-- -- -- -- Username: Password: Remember me Lost your password? Not a member? Register here Resend confirmation instructions Log In | Register Close Toggle navigation PCB007 SMT007 PCBDesign007 EIN007 FLEX007 MilAero007 Toggle navigation Electronics Industry News Events eBooks RTW Blogs -- FEATURED NEWS AND INFORMATION: Major Step Forward for Quantum Technology A team of researchers from Finland, Sweden, and Japan have developed a semiconductor component in which quantum information can be efficiently exchanged between electron spin and photons at room temperature and above.... Yageo, Hon Hai to Form a Semiconductor Joint Venture, XSemi Yageo Group and Hon Hai Technology Group announced to enter into a joint venture agreement to form XSemi Corporation. The goal of this newly... Simple Robots, Smart Algorithms: Meet the BOBbots Anyone with children knows that while controlling one child can be hard, controlling many at once can be nearly impossible. Getting swarms of robots to work collectively can be equally challenging, unless researchers... Complex Shapes of Photons to Boost Future Quantum Technologies Researchers at Tampere University Photonics Laboratory have demonstrated how two interfering photons can bunch into various shapes.... Velodyne Lidar Launches Breakthrough Intelligent Infrastructure Solution Velodyne Lidar, Inc. has launched its Intelligent Infrastructure Solution designed to solve some of the most challenging and pervasive infrastructure... Keep Up to Date With “Industry Leaders Speak Out: COVID-19 Outbreak” Forum The coronavirus (COVID-19) has taken us all into uncharted waters. That’s why I-Connect007 has launched "Industry Leaders Speak Out," a bulletin board. -- Click Here for More News We search high and low to find the best news for you, our valuable readers… If you have news you would like to publish here please send your news item to: news@iconnect007.com Click here for press release tips MORE NEWS -- Latest News Major Step Forward for Quantum Technology New Today | Tampere University Yageo, Hon Hai to Form a Semiconductor Joint Venture, XSemi New Today | Hon Hai Precision Industry Co., Ltd. Simple Robots, Smart Algorithms: Meet the BOBbots New Today | Georgia Tech Complex Shapes of Photons to Boost Future Quantum Technologies New Today | Tampere University Velodyne Lidar Launches Breakthrough Intelligent Infrastructure Solution New Today | Business Wire Electronic Nose Distinguishes Mint Scents 05/07/2021 | KIT IBM Unveils World's First 2 Nanometer Chip Technology 05/07/2021 | IBM Researchers Develop New Graphene-based Sensor Technology for Wearable Medical Devices 05/07/2021 | Trinity College Dublin Smaller, More Powerful, Unrivaled 05/07/2021 | Fraunhofer-Gesellschaft GENERA, Henkel Collaborate to Further Drive End-use Production in Additive Manufacturing 05/07/2021 | Henkel FEATURED ARTICLES AND COLUMNS: Exciting Advances From NVIDIA’s GPU May 3, 2021 | Dan Feinberg, I-Connect007 NVIDIA’s Graphics Processing Technology Conference was, as expected, a showcase of new developments, as well as an opportunity for engineers and developers to learn, enhance skills, and discuss new ideas. Just hearing about all the amazing new developments and the accelerating expansion of AI in virtually all aspects of modern society gives those who attended a better idea of just how much AI is and will continue to change their work and our world. CONTINUE I-Connect007 Editor’s Choice: Five Must-Reads for the Week April 30, 2021 | Nolan Johnson, I-Connect007 This week’s biggest news came in the form of industry briefings—there were a lot of them and the news was universally positive. The news you need to read for this week includes three reports from IPC detailing: the strength and risks in the global economic recovery; a strong EMS book-to-bill ratio; and strong North American PCB sales. Zeroing in on a single company, Apple reported a significant jump in revenue. CONTINUE Benchmarking Your Process Engineering April 29, 2021 | I-Connect007 Editorial Team Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer. CONTINUE More news... tag. * * If you do not want to deal with the intricities of the noscript * section, delete the tag (from ... to ). On * average, the noscript tag is called from less than 1% of internet * users. */-- -- SMT007 Magazine IPC Committees Featuring: The Structure Behind IPC Committees Interview with Teresa Rowe IPC: Driving Our Industry for 64 Years by Dan Feinberg An Inside Look at the IPC Committee Process Interview with IPC directors and program managers IPC Technical Staff Liaisons—Your ‘Shepherds’ in the IPC Standards Development Process by John Perry Why You Should Get Involved in IPC Standards by Chris Jorgensen A Tribute to Dieter Bergman by David Bergman Get Involved with IPC’s EHS-Related Committees by Kelly Scanlon PCB007 Magazine Focus on Manufacturing Featuring: Benchmarking Your Process Engineering Interview with Mark Thompson Driving Down Cost With Process Engineering Interview with Matt Mack Reinvigorate Your Manufacturing Infrastructure by Mark Goodwin Selling for the Best by Dan Beaulieu Benchmarking for Yield Improvement and Scrap Reduction by Todd Johnson Design007 Magazine Top Design Challenges Featuring: PCB Design Challenges: Designing With DDR , Interview with Rick Hartley and Barry Olney The Top Five Reasons Products Fail EMI Testing , by Ken Wyatt Planning and Communication: Keys to Optimizing Your Design Time, by Chris Young My Ongoing Journey Toward DFM , by Kelly Dack My Top Six Design Challenges, by Mark Thompson Meeting the Challenge With Design Reuse , by Stephen V. 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